1. 2. 3. material content data sheet sales product name bfp 193 e6327 issued 29. august 2013 ma# MA000787250 package pg-sot143-4-2 weight* 11.19 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip noble metal gold 7440-57-5 0.002 0.02 161 non noble metal tin 7440-31-5 0.000 0.00 42 inorganic material silicon 7440-21-3 0.016 0.14 0.16 1405 1608 leadframe inorganic material silicon 7440-21-3 0.001 0.01 77 non noble metal titanium 7440-32-6 0.004 0.04 387 non noble metal chromium 7440-47-3 0.013 0.12 1160 non noble metal copper 7440-50-8 4.310 38.52 38.69 385172 386796 wire noble metal gold 7440-57-5 0.010 0.09 0.09 864 864 encapsulation organic material carbon black 1333-86-4 0.105 0.94 9406 inorganic material antimonytrioxide 1309-64-4 0.158 1.41 14108 plastics brominated resin - 0.197 1.76 17636 plastics epoxy resin - 1.645 14.70 146963 inorganic material silicondioxide 60676-86-0 4.473 39.96 58.77 399740 587853 leadfinish non noble metal tin 7440-31-5 0.217 1.94 1.94 19356 19356 plating noble metal silver 7440-22-4 0.039 0.35 0.35 3523 3523 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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